Lecture notes on "Diffusion in Solids"

Our research is focused mainly on interdiffusion studies in the systems related to electronic packaging and also the systems related to high temperature applications. For example, Cu-Sn, Ni(P)-Sn, Au-Sn systems play an important role in the flip chip bonding, which is the most preferred bonding methods in high density packaging. Research is also initiated on Cu-interconnects, which replaced Al-interconnects in modern integrated circuits. Study is going on the growth of Nb3Sn superconductors and also to understand diffusion mechanism in A15 intermetallic structures.

Further, research is also going on to study the effect of different elements in Ni-based alloys, which is used in current third generation gas turbines. Further, research is also going on to Nb-based silicides, which has potential to replace Ni-based superalloys for higher performance. Research is also going in other hight temperature systems, for example, Co-Ni-Nb and Fe-Ni-Nb.

In due process, we also study the Kirkendall effect and and developing the physico-chemical approach, which not only calculates the diffusion parameter, but also explains the morphological evolution during interdiffusion in the solid-state.

Further details can be found in the research page.