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Thin film residual stress |
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| Model | : |
KLA Tencor FLX 2320 |
| Specifications | : |
Measures curvature of plates and beams using laser. Heating stage upto 500C in ambient atmospheres or under inert gas shrouding . Liquid nitrogen can circulated to reach temperatures down to 0 C. Dual beam enables stresses measurements for transparent coatings as well. |
| Procedure | : |
Measure the curvature of substrate before and after the deposition and, knowing the substrate and film thickness and substrate elastic modulus, use Stoney's equation to find the stress. |
| Statical Strain | : |
Maximum size is 8 inches wafer. Plates, disks, beams with longest measurable length less than 8 inches dia. can also be used. |
| Faculty in charge | : |
Vikram Jayaram |
| Contact person | : |
Students trained to use the instrument: Sumanth G, Nisha Verma |